BNFCorporation

Introduction of item

Paste
Model Name Alloy Composition Powder Type (Size) Flux Content Viscosity Tackiness Feature
8hr
Sn-Ag-Cu based SAC305 LST309M-K21 SAC305 20~38 11~12 180 140 -Good BGA wettability – For Fine Pitch
- Good continuous printability and high-speed printability
LST309M SAC305 20~38 11~12 180 135 -For the decrease of void defect. Thermal resistance. Good continuous printability
LST305-T5 K22 SAC305 15~25 11~12 180 140 -For Fine Pitch BGA, - Good wettability
For Halogen Free use LST305-ER (HF) SAC305 20~38
15~25
11~13 180 150 -For Halogen Free use
Sn-Ag-Cu based SAC105 LST105-ER (HF)
LST305-ER (HF)
SAC105 20~38 11~12 180 130 -For Low Ag Halogen Free use
-Good printability and workability
LST105 SAC105 20~38 11~13 180 140 -Good Low Ag printability, -Good BGA wettability
LST105 T5 K22
LST305-T5 K22
SAC105 T15~25 11~13 190 125 -For Fine Pitch BGA, -Good BGA wettability
Low Temperature LST57A Sn57Bi1Ag 38~63 9~11 160-180 130 -Low melting Point Solder Paste. –Nozzle Printing
LST5710 Sn57Bi1Ag 20~38 11~2 180~200 130 -Low melting Point Solder Paste for SMT